Chip On Flex Market

Chip on flex or chip-on-flex (COF) is a semiconductor assembly technology in which a die is mounted on a flexible substrate instead of a printed circuit board. Its features of heat sinks, shielding, panelization, over molding, and graphic overlay in COF can drive its production to be used in flexible electronics. The global chip on flex market report by Market Research Future (MRFR) contains insights and foresights for the industry for the period of 2016 to 2021 (forecast period). It even takes into consideration the impact of the COVID-19 pandemic.

Market Scope

The global chip on flex market is expected to reach USD 1795 million by 2021. It was valued at USD 1437 million in 2016. It is estimated to exhibit a CAGR of 4.43% over the forecast period. The huge need for flexible electronics and its applications in radiofrequency identification (RFID), biomedical implants, lighting, sensors, and others can drive the market demand over the forecast period.

The massive demand for miniature components and flexible batteries can augur favorably for the market till 2021. The transition to smart devices and other consumer electronics can offer huge scope of growth to the market. The use of chip scale packaging for packaging more than one chip as well as manufacture of instruments with high precision will bolster the market demand throughout the forecast period.

But soaring costs of raw materials and rapid strides in new technologies can threaten market growth.

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Segmentation

The global chip on flex market has been segmented on the basis of types, applications, and verticals. The types of chip-on-flex are one sided chip-on-flex and others. The one sided COF captured 94.43% of market share. It is expected to garner huge revenues for the market due to its application in consumer electronics. Applications are divided into static and dynamic flexing. The various verticals of chip on flex market are aerospace, military, medical, electronics and others.

Regional Analysis

The regional analysis of chip on flex market is being studied for areas such as Asia Pacific (APAC), North America, Europe, and Rest-of-the-World (RoW).  APAC is expected to record highest growth rate owing to existence of large number of COF manufacturers in China like Danbond Technology, Compass Technology Company, AKM Industrial, and others. 

It will be followed by North America owing to increased adoption of new technologies especially in the automotive sector. The mergers of various organizations to enhance the production capabilities in chip on flex market can fuel the market growth tremendously in the region. The U.S. is estimated to lead in the region owing to inclination towards flexible electronics and penchant for novel consumer electronic devices.

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Many well established firms such as AKM Industrial, Compunetics and others are increasing their sales area in the Europe region which will lead to the growth of Europe region in chip on flex market. The Europe COF market valuation can touch USD 494 million by 2021. Germany is likely to lead in the region owing to investments in automotive infotainment. Fusion of sensors made possible by chip-scale packaging can pave the way for real-time imaging with applications in spectroscopy and chemical sensing.

Competitive Outlook

Stars Microelectronics Public Company Ltd, Flexceed, CWE, Compass Technology Company Limited, Danbond Technology Co. Ltd., AKM Industrial Company Ltd., Stemko Group, Chipbond Technology Corporation, Compunetics, and LGIT Corporation are key players of the global chip-on-flex market. Collaborations, partnerships, and agreements are prime strategies of players in the market.

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