Semiconductor Assembly and Testing Services Market Share 2022 Trends, Opportunities, Report to 2030

Semiconductor Assembly Testing Services Market

Semiconductor assembly and testing services offers performance testing using skilled personnel and lowers stress on active area. The global semiconductor assembly and testing services market size is poised to reach USD 28 billion by 2022, according to the latest report by Market Research Future (MRFR). It can expand at 4.5% CAGR from 2016 to 2022. MRFR’s report on the semiconductor assembly and testing services market segments it by services and applications by offering insights on the industry for the forecast period (2020-2027). The COVID-19 pandemic and its influence on the market has been described in comprehensive detail.

Market Scope

The global semiconductor assembly and testing services market is fueled by increasing sales of electronic equipment. Focus on quality and reliability of semiconductor chips on the final price can induce demand for assembly and testing services. These are outsourced to third-party companies and supplied through a reliable vendor for final product assemblage. Rise in expendable income levels of customers and economic growth can influence market growth.

High-end packaging technologies and penetration of routers, tablets, and other devices can drive the semiconductor assembly and testing services (SATS) market. Rising uses of automation can create new growth avenues for the market.

But high costs of testing and assembly services can impede market growth.

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COVID-19 Impact

The COVID-19 pandemic has affected the semiconductor assembly and testing services market owing to shutdown of manufacturing facilities. This caused a chip shortage affecting all verticals reliant on chips and ICs. Semiconductor companies are expanding their facilities to overcome their demand woes and trying to implement testing through remote workstations.

Segmentation

Assembly Services to Register 4.6% CAGR

Assembly services can command a huge market share owing to assembly of semiconductor parts or components. Demand for packages in the consumer electronics industry is expected to drive segment demand.

Telecommunication Vertical to Dominate Market Demand

The telecommunication vertical is set to dominate market demand owing to development of smartphones, wearables, and other smart devices. Compatibility of semiconductors with the latest wireless spectrum and benefits of miniaturization, low power consumption, and thermal electrical performance can drive the demand of the market in the telecommunication industry.

Regional Analysis

APAC to Lead in Global SATS Market

Asia-Pacific (APAC) is expected to lead in global demand of SATS owing to assembly and production of smart devices and wearables. SATS providers are expanding their operations to South Korea, China, Taiwan, and other South Asian countries to capitalize on investments by software companies. Demand for mobility and connectivity as well as demand for packaging techniques can drive regional market growth.

Competitive Analysis

STATS ChipPAC Ltd (Singapore), Advanced Semiconductor Engineering, Inc. (U.S.), CORWIL Technology (U.S.), Chipbond Technology Corporation (U.S.), Global Foundries (U.S.), Powertech Technology Inc. (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology, Inc. (U.S.), and Integrated Micro-Electronics, Inc. (U.S.) are key players in the global semiconductor assembly and testing services market.

Industry News

INFICON GmbH’s UL6000 Fab can detect leaks during production of semiconductor chips. It uses the vacuum method and the helium gas for detecting the minute leaks.

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